? EGP50A thru egp50g vishay semiconductors formerly general semiconductor document number 88585 www.vishay.com 24-apr-03 1 glass passivated ultrafast rectifier reverse voltage 50 to 400 v forward current 5.0 a maximum ratings & thermal characteristics ratings at 25c ambient temperature unless otherwise specified. parameter symbol EGP50A egp50b egp50c egp50d egp50f egp50g unit maximum repetitive peak reverse voltage v rrm 50 100 150 200 300 400 v maximum rms voltage v rms 35 70 105 140 210 280 v maximum dc blocking voltage v dc 50 100 150 200 300 400 v maximum average forward rectified current 0.375" (9.5mm) lead length at t l = 55c i f(av) 5.0 a peak forward surge current 8.3ms single half sine-wave i fsm 150 a superimposed on rated load typical thermal resistance (note 1) r ja 20 c/w r jl 5.0 operating and storage temperature range t j ,t stg ?65 to +150 c electrical characteristics ratings at 25c ambient temperature unless otherwise specified. parameter symbol EGP50A egp50b egp50c egp50d egp50f egp50g unit maximum instantaneous forward voltage at 5.0a v f 0.95 1.25 v maximum dc reverse current t a = 25c 5.0 at rated dc blocking voltage t a = 125c i r 50 a maximum reverse recovery time at i f = 0.5a, i r = 1.0a, i rr = 0.25a t rr 50 ns typical junction capacitance at 4.0v, 1mhz c j 95 75 pf note: (1) thermal resistance from junction to ambient, and from junction to lead at 0.375? (9.5mm) lead length, p.c.b. mounted * glass encapsulation technique is covered by patent no. 3,996,602, brazed-lead assembly to patent no. 3,930,306 dimensions in inches and (millimeters) patented* 0.210 (5.3) 0.190 (4.8) dia. 0.042 (1.07) 0.037 (0.94) dia. 1.0 (25.4) min. 0.375 (9.5) 0.285 (7.2) 1.0 (25.4) min. features plastic package has underwriters laboratories flammability classification 94v-0 cavity-free glass passivated junction ultrafast recovery time for high efficiency low forward voltage, high current capability low leakage current high surge current capability high temperature metallurgically bonded construction high temperature soldering guaranteed: 300c/10 seconds, 0.375" (9.5mm) lead length, 5 lbs. (2.3kg) tension mechanical data case: molded plastic over solid glass body terminals: axial leads, solderable per mil-std-750, method 2026 polarity: color band denotes cathode end mounting position: any weight: 0.03 oz., 0.8 g gp20
EGP50A thru egp50g vishay semiconductors formerly general semiconductor www.vishay.com document number 88585 2 24-apr-03 ratings and characteristic curves (t a = 25c unless otherwise noted) fig. 2 ?maximum non-repetitive peak forward surge current peak forward surge current (a) number of cycles at 60 h z 0.01 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 0.1 1 10 50 fig. 1 ?maximum forward current derating curve average forward rectified current (a) lead temperature ( c) instantaneous forward voltage (v) fig. 3 ?typical instantaneous forward characteristics fig. 4 ?typical reverse leakage characteristics instantaneous reverse leakage current ( a) percent of rated peak reverse voltage (%) instantaneous forward current (a) reverse voltage (v) junction capacitance (pf) fig. 5 ?typical junction capacitance t, pulse duration (sec.) transient thermal impedance ( c/w) fig. 6 ?typical transient thermal impedance 6.0 0 25 50 75 100 125 150 175 0 1.0 2.0 3.0 4.0 5.0 175 1 10 100 0 25 50 75 100 125 150 0 20 40 60 80 100 0.001 0.01 0.1 1 10 100 0.1 1 10 100 1,000 0 30 60 90 120 150 180 210 0.01 0.1 1 10 100 0.1 1.0 10 100 pulse width = 300 s 1% duty cycle EGP50A ? egp50d egp50f & egp50g EGP50A ? egp50d egp50f & egp50g t j = 25 c t j = 150 c t j = t j max. 8.3ms single half sine-wave (jedec method) t j = 150 c t j = 125 c t j = 75 c t j = 25 c t j = 25 c f = 1.0 mh z vsig = 50mvp-p resistive or inductive load 0.375" (9.5mm) lead length copper heatsinks l t l
|
